Engineer -I
--Qualcomm--
Job Description: The candidate will primarily be responsible for repairing and reworking complex boards. This includes handling BGA, POP memories, 01005 size discrete components, and parts with various packages and footprints. A strong foundation in electronic SMT assembly processes is crucial, along with a thorough understanding of reflow profiles, setting, and fine-tuning them. The candidate should be capable of understanding circuit functions, interpreting written or verbal rework instructions, and possess a functional understanding of general test equipment, rework tools, and machines.
Good communication skills and strong PC skills are essential, as the candidate will collaborate closely with debug engineers for the repair and maintenance of a variety of hardware devices. An understanding of schematics and layouts is highly desirable.
Additionally, the candidate should have good experience in the disassembly and assembly of phones and various electronic devices. Proficiency with JTAG debuggers is also necessary.
A diploma in Electronics or a similar discipline, coupled with 2+ years of relevant experience, is required.